.jpg)
- Manufacturer：
-
- Cooling Source (2)
- CUI Devices (1)
- Material：
-
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
6 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
ASSMANN WSW Components | HEATSINK ANOD AL... |
1-3 days |
22,553
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 10 ... |
1-3 days |
4,812
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEAT SINK ELLIP F... |
1-3 days |
6,719
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEAT SINK PIN FIN... |
1-3 days |
7,081
In-stock
|
View details Get Quote | ||
|
|
Cooling Source | 10X10X10MM, T412 |
1-3 days |
2,931
In-stock
|
View details Get Quote | ||
|
|
Cooling Source | 10X10X10MM T411 |
1-3 days |
1,750
In-stock
|
View details Get Quote |
