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- Manufacturer：
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- CUI Devices (1)
- Ohmite (1)
- Product Status：
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- Material：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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8 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
T-Global Technology | CERAMIC HEAT SIN... |
1-3 days |
903
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 12 ... |
1-3 days |
131
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK CPU XCU... |
1-3 days |
8,390
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
1-3 days |
6,873
In-stock
|
View details Get Quote | ||
|
|
T-Global Technology | CERAMIC HEATSINK |
1-3 days |
6,048
In-stock
|
View details Get Quote | ||
|
|
T-Global Technology | HEATSINK CER 12X12... |
1-3 days |
9,414
In-stock
|
View details Get Quote | ||
|
|
T-Global Technology | HEATSINK CER 12X12... |
1-3 days |
5,929
In-stock
|
View details Get Quote | ||
|
|
Ohmite | HEATSINK BLACK A... |
1-3 days |
8,512
In-stock
|
View details Get Quote |
