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- Manufacturer：
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- Comair Rotron (1)
- Material：
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- Attachment Method：
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- Package Cooled：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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10 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK CPU 27.9M... |
1-3 days |
9,717
In-stock
|
View details Get Quote | ||
|
|
Comair Rotron | HEATSINK STAMP 9.... |
1-3 days |
9,423
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1-3 days |
9,566
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1-3 days |
5,604
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1-3 days |
5,648
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1-3 days |
8,345
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1-3 days |
9,299
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1-3 days |
7,297
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1-3 days |
6,394
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1-3 days |
9,185
In-stock
|
View details Get Quote |
