.jpg)
- Manufacturer：
-
- BOYD (3)
- Material：
-
- Diameter：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
5 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
1-3 days |
3,897
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
34
In-stock
|
View details Get Quote | ||
|
|
NTE Electronics, Inc. | HEAT SINK-TO-5 TRA... |
1-3 days |
16
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
9,244
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
7,052
In-stock
|
View details Get Quote |
