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- Manufacturer：
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- BOYD (1)
- CUI Devices (1)
- Material：
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- Package Cooled：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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2 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
6,182
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
6,029
In-stock
|
View details Get Quote |
