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- Manufacturer：
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- CUI Devices (2)
- Material：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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4 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | EXTRUSION 300X51.6X... |
1-3 days |
47
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION P... |
1-3 days |
11
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
8,603
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 7.4W... |
1-3 days |
7,596
In-stock
|
View details Get Quote |
