.jpg)
- Material：
-
- Attachment Method：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
3 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
1,885
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 4.8W... |
1-3 days |
2,963
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
2,210
In-stock
|
View details Get Quote |
