- Manufacturer:
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- CUI Devices (2)
- Material:
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- Attachment Method:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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5 Records
Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
---|---|---|---|---|---|---|---|
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CUI Devices | HEAT SINK, BGA, 27 ... |
1-3 days |
259
In-stock
|
View details Get Quote | ||
![]() |
CUI Devices | HEAT SINK, BGA, 25 ... |
1-3 days |
96
In-stock
|
View details Get Quote | ||
![]() |
Wakefield Thermal | HEATSINK 23X18MM S... |
1-3 days |
5,407
In-stock
|
View details Get Quote | ||
![]() |
Wakefield Thermal | HEATSINK 23X18MM F... |
1-3 days |
22
In-stock
|
View details Get Quote | ||
![]() |
Wakefield Thermal | HEATSINK 23X18MM D... |
1-3 days |
8,910
In-stock
|
View details Get Quote |