.jpg)
- Manufacturer：
-
- CUI Devices (2)
- Material：
-
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
3 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 12 ... |
1-3 days |
131
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 23 ... |
1-3 days |
1,321
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | 1/2 BRICK HEATSINK... |
1-3 days |
76
In-stock
|
View details Get Quote |
