- Manufacturer:
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- BOYD (2)
- Material:
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- Attachment Method:
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- Package Cooled:
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- Fin Height:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Material Finish:
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4 Records
Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
---|---|---|---|---|---|---|---|
![]() |
BOYD | HEATSINK TO-218/TO... |
1-3 days |
9,203
In-stock
|
View details Get Quote | ||
![]() |
Wakefield Thermal | HEATSINK 40X40X23MM... |
1-3 days |
430
In-stock
|
View details Get Quote | ||
![]() |
Wakefield Thermal | HEATSINK 40X40X23MM... |
1-3 days |
32
In-stock
|
View details Get Quote | ||
![]() |
BOYD | HEAT SINK |
1-3 days |
7,863
In-stock
|
View details Get Quote |