- Product Status:
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- Material:
-
- Attachment Method:
-
- Package Cooled:
-
- Fin Height:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Material Finish:
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4 Records
Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
---|---|---|---|---|---|---|---|
![]() |
BOYD | BOARD LEVEL HEAT... |
1-3 days |
7,421
In-stock
|
View details Get Quote | ||
![]() |
BOYD | BOARD LEVEL HEAT... |
1-3 days |
9,072
In-stock
|
View details Get Quote | ||
![]() |
Ohmite | CERAMIC HEATSINK... |
1-3 days |
6,649
In-stock
|
View details Get Quote | ||
![]() |
Ohmite | CERAMIC HEATSINK... |
1-3 days |
6,166
In-stock
|
View details Get Quote |