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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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2 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
7,421
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
9,072
In-stock
|
View details Get Quote |
